A one-component heat-curing epoxy resin adhesive proposed by Ajinomoto Fine-Techno.
Achieve 60℃ curing! A one-component epoxy adhesive that contributes to effective resource utilization and waste reduction!
The "Plain Set" is an industrial adhesive that can be utilized in various fields such as precision electronic components like camera modules, semiconductor mounting, and car electronics. This product was developed based on the technology of latent curing agents that our company has accumulated over the years. Since there is no waste from leftover usage like with two-component types, it contributes to the effective use of resources and waste reduction. 【Features】 ■ Single-component ■ Storage stability ■ Low-temperature curing ■ Fast curing ■ Wide range of lineup *For more details, please refer to the catalog or feel free to contact us.
- Company：味の素ファインテクノ
- Price：Other
